A: EBG was founded in 1977 in Kirchbach, Austria, and became one of the earliest specialist manufacturers focused on high voltage thick film resistors. In 2010, EBG was acquired by Miba AG, and in 2024 the brand was formally unified under the name Miba Resistors. In other words, legacy EBG part numbers and current Miba part numbers refer to the same physical product line. For selection and ordering, the latest Miba PDF datasheet should be treated as the official reference.

A: HVC publicly states that its high voltage thick film resistor line is built to the same quality level as globally recognized brands such as EBG. From the process point of view, both product families rely on the same core technology platform:

Core process comparison:

Dimension	EBG / Miba	HVC HVR	Conclusion
Substrate Material	96% Al2O3 ceramic	96% Al2O3 ceramic	Equivalent
Resistor Paste	RuO2 thick film	RuO2 thick film	Same material system
Firing Temperature	Approx. 850C	Approx. 850C	Same process window
Inductance Control	Non-inductive	Non-inductive	Same class
Working Temperature	-55 ~ +155C	-55 ~ +155C	Equivalent
TCR Coverage	+/-10 ~ +/-250 ppm	+/-25 ~ +/-100 ppm (standard)	Mainstream grades covered
Voltage Capability	22 ~ 96 kV	35 kV (planar) / 60 kV+ (cylindrical)	Mainstream grades covered; higher levels custom
Tolerance Range	+/-0.1% ~ +/-10%	+/-0.5% (F) ~ +/-5% (J)	0.1% available by custom approval

In addition, the HVC resistor line is supported by engineers with prior EBG background, which helps ensure strong process alignment. Up to now, companies including Planmeca, Haining Jingyi Electronics (associated with iRay SH688301), Spellman, and Hitek Power have completed qualification or volume validation.

A: In most cases, no PCB redesign is required. For planar families such as FBX/FEP/FSX, FPX/FLX, and MTX 967, the HVRGFP/HVRGXP size codes correspond directly to the form factors shown in the original PDF, such as 1/2, 2/2, 3, 4, 5/5, 6/5, and 8/5. MTX 967 replacements should be confirmed with the exact PDF configuration code. For cylindrical families such as SGT, SGP, and OSX, HVR-BSP uses the standard phi7 body and the body length L maps directly to the EBG suffix. As a practical step, HVC recommends sending the original EBG order code to sales@hv-caps.com for a final PCB compatibility check before first article approval.

A: Yes. The mainstream EBG TCR ranges of +/-25 to +/-100 ppm are fully covered by HVC standard offerings:

• EBG SGT (+/-25 ppm) → HVR-BSP -F-25- grade for direct alignment
• EBG SSP/OSP (+/-50 ppm) → HVR-BSP -F-50- grade
• EBG SGP/OGP (+/-80 ppm) → HVR-BSP standard grade or -F-80-

For ultra-low TCR options used in MTX 967/969, such as +/-10 to +/-15 ppm, HVC can support equivalent performance through the GHP custom line, subject to original part number review and sample confirmation.

A: Two approaches are recommended:

1. Manual table lookup: Use the quick reference family table below to identify the corresponding HVC family, then map resistance value, length, voltage rating, and tolerance into the HVC coding structure.
2. One-step BOM matching (recommended): Send the complete BOM in Excel format to sales@hv-caps.com. HVC can normally return a full cross-reference proposal within two working days.

EBG to HVC family quick-reference table:

EBG / Miba Product Family	Typical Power	Typical Voltage	Package / Size	HVC Replacement
FBX / FEP / FSX	0.5 ~ 5 W	Up to about 29 kV (family-dependent)	Planar A×B, see PDF	HVRGFP (e.g. HVRGFP 6/5)
FPX / FLX	1.5 ~ 7.5 W	Up to about 22 kV (family-dependent)	Planar A×B, see PDF	HVRGXP (e.g. HVRGXP 4)
MTX 967	1 ~ 10 W	Up to 35 kV	967.xx.xx config code	HVR-GHP / HVRGXP custom
SGT	1 ~ 6 W	4 ~ 30 kV	phi8.2 × L mm	HVR-BSP-7×L
SGP / OGP	See PDF	See PDF	phi8.2 / phi3.5	HVR-BSP / HVR-BOP
SSP / OSP	See PDF	See PDF	phi8.2 / phi4.2	HVR-BSP
OSX / SSX / SOX	See PDF	See PDF	Independent cylindrical families	HVR-BSP-7×L
PHV	See PDF	See PDF	Encapsulated family	HVR-BSP + encapsulation proposal
MTX 968 / 969	See PDF	9 ~ 96 kV	Divider / cap-end structure	HVR-BSP sample approval
MTX 969 W	500 ~ 1700 W	5 ~ 10 kV	Water-cooled	Water-cooled engineering proposal
MTX 2000	10 ~ 50 W	40 ~ 80 kV	Divider network	Divider-ratio custom approval
ESP	Pulse class	1 kV DC	62 mm body	ESP-62/14 / ESP-62/20 → engineering inquiry

For customers who need a faster engineering reference, the following two tables list representative direct replacements that frequently appear in medical imaging, HV power supply, and industrial inspection BOMs.

Representative planar replacement list:

EBG / Miba Model	Power	Max. Continuous DC Voltage	Package Size	HVC Replacement
FBX 1/2	0.50 W	3 kV	12.90 × 3.40 mm	HVRGFP 1/2
FBX 6/5	1.20 W	5 kV	20.00 × 5.08 mm	HVRGFP 6/5
FBX 3	3.00 W	9 kV	38.30 × 6.60 mm	HVRGFP 3
FSX 4	4.00 W	15 kV	51.30 × 7.50 mm	HVRGFP 4
FPX 2/2	7.50 W	16.5 kV	51.00 × 12.90 mm	HVRGXP 2/2
MTX 967.15.51	4.50 W	30 kV	50.8 × 15.0 mm	HVRGHP15.51

Representative cylindrical replacement list:

EBG / Miba Model	Power	Max. Continuous DC Voltage	Body Size	HVC Replacement
SGT-39	1.50 W	6 kV	phi8.2 × 39.5 mm	HVR-BSP 40
SGT-103	4.00 W	20 kV	phi8.2 × 102.9 mm	HVR-BSP 103
SGP-52	7.50 W	10 kV	phi8.2 × 52.1 mm	HVR-BSP 52
OGP-26	1.90 W	4 kV	phi4.2 × 26.2 mm	HVR-BOP-3.5×26
SSX-124	15.50 W	40 kV	phi8.2 × 123.7 mm	HVR-BSP 124
PHV-103	12.00 W	32 kV	phi8.2 × 102.9 mm	HVR-BSP 103 + encapsulation option

If your project includes a mixed BOM of planar, cylindrical, and custom divider structures, HVC can also return a project-specific model-by-model conversion table rather than only a family-level cross reference.

A: At minimum, the following three validation items are recommended, and HVC can support sample-based testing:

1. DC withstand test: Hold at 1.5x rated voltage for 60 seconds and confirm no breakdown or flashover.
2. Temperature cycling: Run -55 to +155 C for 10 cycles and verify resistance drift stays below 0.5%.
3. Partial discharge (PD) test: The most critical check; confirm PD remains below 5 pC at 50% to 80% of rated voltage.

If the application involves pulse loading, pulse energy endurance testing should also be added.

A: For target part numbers, HVC can typically provide 2 to 5 free samples. Sample lead time is about 2 weeks, while standard production lead time is usually 3 to 4 weeks, significantly shorter than the 16 to 24 weeks often seen from EBG.

A: In batch purchasing, customers typically reduce BOM cost by about 20% to 40%. The actual savings depend on the exact part number, quantity, coating requirement, and validation level. The best practice is to send the full BOM for a project-based quotation.

A: If the part is non-standard or custom, simply send the full original EBG order code together with the datasheet or photos to sales@hv-caps.com. HVC's engineering team can normally provide a proposed equivalent within two working days. For standard catalog suffixes, HVC still recommends checking the latest Miba PDF body text first.

A: This is exactly the value of dual-source planning. Once HVC has passed validation and entered your AVL, you can flexibly allocate purchasing volumes based on supply conditions, for example EBG 70% and HVC 30%, or temporarily shifting HVC to 100% when EBG lead time becomes too long. In this sense, dual-source does not mean "replacement only"; it means "operational insurance".

A: Yes. By increasing body length in the BSP cylindrical line, such as 76 mm, 103 mm, 127 mm, or 152 mm, HVC can support applications above 60 kV. For extreme cases such as EBG MTX 969 at 96 kV, HVC normally performs a dedicated engineering review including body length and special encapsulation structure. The original part number should always be provided for quotation.

A: In the HVC BSP series, the -F-25- coding position corresponds directly to the +/-25 ppm TCR grade. For example, HVR-BSP-7x52-100M-F-25-10k indicates a phi7 body, 52 mm length, 100 MOhm resistance, F-grade tolerance (+/-0.5%), +/-25 ppm TCR, and 10 kV rated voltage. Simply specify the TCR target when requesting a quote.

A: In the EBG FBX family, suffixes such as 6/5, 10, and 16 are mechanical form-factor codes. HVRGFP and HVRGXP include equivalent dimensional classes. For example, FBX-6/5 10M 1% can be mapped directly to HVRGFP 6/5 10M 1%, allowing the existing PCB pad layout to be reused.

A: HVC case references mention validated use by military-grade end users, indicating that the product line has already entered high-reliability programs. If your project requires a specific military screening level, such as a MIL-PRF-based flow, the best approach is to discuss the exact requirement with the HVC engineering team and define a custom qualification path.